Samsung, Applied Materials back startup targeting chip packaging warpage

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 15 Oct, 04:27 UTC

Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor packaging deformation before manufacturing. The investment comes as increasingly complex AI chips create new…

hardware

Sources

• T2Samsung, Applied Materials back startup targeting chip packaging warpageJP/KR/TW: Korea Herald / Taipei Times / DigiTimes15 Oct, 04:27