Beyond Lithography: 3D Scaling Puts New Demands on Materials

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 14 Oct, 18:29 UTC

ASM International shows how building increasingly complex 3D devices requires advances in materials and processes. The post Beyond Lithography: 3D Scaling Puts New Demands on Materials appeared first on EE Times.

hardware

Sources

• T2Beyond Lithography: 3D Scaling Puts New Demands on MaterialsSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly14 Oct, 18:29