TDK introduces new dual-die, stray-field robust motor position sensor for ASIL D fail operational applications

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 14 Oct, 13:56 UTC

– Full redundancy through two independent dies stacked in a compact QFN24 4×4 mm² package – ASIL D ready as a Safety Element out of Context (SEooC), with integrated diagnostics and independent fault detection for each die – Stray-field compensation per ISO 11452-8:2015 via an array of six…

hardware

Sources

• T2TDK introduces new dual-die, stray-field robust motor position sensor for ASIL D fail operational applicationsSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly14 Oct, 13:56