Broadcom executive says chipmakers must tackle packaging, power limits together

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 14 Oct, 04:11 UTC

Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that die size, packaging, power delivery, and cooling are becoming major constraints as workloads evolve, making faster…

hardware

Sources

• T2Broadcom executive says chipmakers must tackle packaging, power limits togetherJP/KR/TW: Korea Herald / Taipei Times / DigiTimes14 Oct, 04:11