TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 14 Oct, 00:51 UTC

GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem. The US$2 billion, five-year agreement will expand advanced packaging capacity and support growing demand for…