Foxconn unveils Vera Rubin AI racks, liquid-cooling systems at OCP Summit

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 14 Oct, 00:55 UTC

Foxconn Technology Group showcased rack-scale artificial intelligence infrastructure at the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, combining computing platforms, high-speed interconnects, power delivery, and liquid cooling. The portfolio included Ingrasys…

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• T2Foxconn unveils Vera Rubin AI racks, liquid-cooling systems at OCP SummitJP/KR/TW: Korea Herald / Taipei Times / DigiTimes14 Oct, 00:55