China's AI chipmakers target 3D packaging, optical interconnects and software ecosystems

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 14 Oct, 01:01 UTC

China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration as AI models grow increasingly complex. Three priorities—3D packaging for greater power efficiency, optical interconnects for faster data transmission, and open…