Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 13 Oct, 09:06 UTC

Low-volume production sits between research and mass manufacturing. Europe needs an industrial model to fill the gap. The post Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle appeared first on EE Times.

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Sources

• T2Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing MiddleSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly13 Oct, 09:06