AI substrate material shortages ease, but advanced equipment emerges as expansion bottleneck

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 13 Oct, 07:30 UTC

As the customer base for AI accelerators expands rapidly and consumes IC substrate capacity, advanced packaging remains a critical industry bottleneck. Consequently, supply chain attention has shifted from upstream T-glass cloth used in copper-clad laminates (CCL) to the advanced manufacturing…