Hua Hong deepens China chip equipment partnerships, targets stronger specialty foundry share by 2030

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 13 Oct, 04:29 UTC

China's Hua Hong Group has signed strategic agreements with four domestic semiconductor equipment suppliers to accelerate the adoption of locally developed wafer fabrication tools, reinforcing China's chipmaking self-sufficiency efforts. The partnerships coincide with Hua Hong's ambitious 2030…

hardware

Sources

• T2Hua Hong deepens China chip equipment partnerships, targets stronger specialty foundry share by 2030JP/KR/TW: Korea Herald / Taipei Times / DigiTimes13 Oct, 04:29