South Korea's YMT targets fivefold rise in glass-substrate plating capacity

T2Covered by 1 source · first reported by DigiTimes (headlines) at 13 Oct, 03:29 UTC

South Korean electronic materials supplier YMT is accelerating its expansion into glass-substrate electroplating. The company plans to increase related capacity to roughly four times its current level by the end of 2026 to meet customer demand for through-glass via (TGV) development.

hardware

Sources

• T2South Korea's YMT targets fivefold rise in glass-substrate plating capacityDigiTimes (headlines)13 Oct, 03:29