Beyond CoWoS: Korean firms eye next AI packaging race

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 25 Sept, 07:00 UTC

Taiwan Semiconductor Manufacturing Co.'s advanced packaging technology, chip-on-wafer-on-substrate-L, or CoWoS-L, remains the dominant force in AI semiconductor packaging. But Korean chip substrate makers are already preparing for the next market shift. Samsung Electro-Mechanics and LG Innotek are…