Advanced packaging to be a $51bn market by 2031

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 25 Sept, 05:12 UTC

AI accelerators , HBM Integration, and Co-packaged optics are pushing higher performance packaging past $51 billion by 2031, says Yole. High-end performance packaging revenue has a 27% CAGR during 2025-2031. […] The post Advanced packaging to be a $51bn market by 2031 appeared first on Electronics…

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Sources

• T2Advanced packaging to be a $51bn market by 2031Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly25 Sept, 05:12