Sumitomo Bakelite expands packaging material production across Singapore, China

T2Covered by 1 source · first reported by DigiTimes (headlines) at 12 Oct, 07:37 UTC

Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This is expected to approximately double its production capacity for mold underfill (MUF) materials and approximately…

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Sources

• T2Sumitomo Bakelite expands packaging material production across Singapore, ChinaDigiTimes (headlines)12 Oct, 07:37