TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential
Advanced semiconductor manufacturing is progressing toward 2nm and angstrom-era nodes (Å; where 1 nm equals 10 Å), bringing high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into focus.
Sources
- T2TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potentialDigiTimes (headlines)