Japan’s Sumitomo Bakelite expands China chip packaging materials output amid AI boom

T2Covered by 1 source · first reported by China: SCMP Tech / TechNode / Pandaily / KrASIA / Sixth Tone at 11 Oct, 03:04 UTC

Japanese semiconductor materials giant Sumitomo Bakelite plans to expand production of advanced chip packaging materials in China and Singapore, marking the second such announcement for its Chinese operations in less than four months as artificial intelligence drives demand for more sophisticated…

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Sources

• T2Japan’s Sumitomo Bakelite expands China chip packaging materials output amid AI boomChina: SCMP Tech / TechNode / Pandaily / KrASIA / Sixth Tone11 Oct, 03:04