Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 10 Oct, 06:26 UTC

Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years, according to Nur Hilwani, Technology & Market Analyst, Semiconductor Equipment at France-based Yole Group…

hardware

Sources

• T2Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analystJP/KR/TW: Korea Herald / Taipei Times / DigiTimes10 Oct, 06:26