Semco moves glass substrates to package-level testing

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 10 Oct, 06:27 UTC

Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking progress toward commercializing next-generation packaging technology as AI accelerators grow larger and more…