Globalfoundries to make silicon interposers for TSMC

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 09 Oct, 05:10 UTC

GlobalFoundries is to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at […] The post Globalfoundries to make silicon interposers for TSMC appeared first on…

hardware

Sources

• T2Globalfoundries to make silicon interposers for TSMCSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly09 Oct, 05:10