Demonstrating Plasma As A Viable Alternative To KOH For LCP Metallization Applications

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 08 Oct, 07:05 UTC

How optimized plasma processing can achieve effective surface roughening and activation. The post Demonstrating Plasma As A Viable Alternative To KOH For LCP Metallization Applications appeared first on Semiconductor Engineering.

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• T2Demonstrating Plasma As A Viable Alternative To KOH For LCP Metallization ApplicationsSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly08 Oct, 07:05