Intel and Applied hook up on process

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 08 Oct, 05:14 UTC

Intel and Applied are getting together for a multi-site, multi-technology collaboration on process technology. The work will cover front-end and back-end, transistor development, packaging, interconnect and power delivery. The work […] The post Intel and Applied hook up on process appeared first on…

hardware

Sources

• T2Intel and Applied hook up on processSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly08 Oct, 05:14