Beyond the Die: Verifying the Connected Chip

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 06 Oct, 17:00 UTC

One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have…

hardware

Sources

• T2Beyond the Die: Verifying the Connected ChipSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly06 Oct, 17:00