Chip Industry Technical Paper Roundup: Oct. 6

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 06 Oct, 07:01 UTC

Low-contact-resistance WSe₂ transistors; backside clock meshes for 2nm GAAFETs; row-parallel processing in DRAM; HBF for high-throughput LLM serving; formal security analysis of CAN XL; abstraction and validation from physical devices to RTL. The post Chip Industry Technical Paper Roundup: Oct. 6…

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Sources

• T2Chip Industry Technical Paper Roundup: Oct. 6Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly06 Oct, 07:01