Bernstein: Kirin 9050 Pro Multicore Tops A17 Pro as Huawei Narrows Mobile-Chip Gap Without EUV

T2Covered by 1 source · first reported by China: SCMP Tech / TechNode / Pandaily / KrASIA / Sixth Tone at 23 Sept, 07:41 UTC

Equity research firm Bernstein says Huawei's Kirin 9050 Pro, estimated at a 7nm-class node and built with LogicFolding under the Tau Scaling Law, beat Apple's 3nm A17 Pro in Geekbench 6 multicore and cut the mobile-chip gap to about three years—without EUV lithography.

hardware

Sources

• T2Bernstein: Kirin 9050 Pro Multicore Tops A17 Pro as Huawei Narrows Mobile-Chip Gap Without EUVChina: SCMP Tech / TechNode / Pandaily / KrASIA / Sixth Tone23 Sept, 07:41