China turns to 3D packaging to push AI performance beyond front-end scaling limits

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 02 Oct, 07:24 UTC

Chip-performance gains have long been driven by an industry-wide focus on shrinking transistor nodes and tightening integration. While major economies including the US and Taiwan have historically sat at the summit of semiconductor manufacturing excellence, China has spent years building its own…