Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 02 Oct, 02:16 UTC

The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED optical communications move closer to mass production, semiconductor equipment, materials, and optoelectronics…

hardware

Sources

• T2Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholdsJP/KR/TW: Korea Herald / Taipei Times / DigiTimes02 Oct, 02:16