Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC

T2Covered by 1 source · first reported by DigiTimes (headlines) at 24 Sept, 02:42 UTC

Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat dissipation. During a media Q&A, Qualcomm Senior Vice President and General Manager of Mobile Handsets Chris…

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Sources

• T2Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoCDigiTimes (headlines)24 Sept, 02:42