Managing 3D-IC Design And IP

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 24 Sept, 07:05 UTC

Design data management, traceability, and revision control are critical for multi-chiplet heterogeneous integration. The post Managing 3D-IC Design And IP appeared first on Semiconductor Engineering.

hardware

Sources

• T2Managing 3D-IC Design And IPSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly24 Sept, 07:05