Huawei’s Mate 90 bets on 3D chip design to get around US curbs

T2Covered by 1 source · first reported by Africa: TechCabal / Techpoint Africa / TechCentral / WeeTracker / Ventureburn at 01 Oct, 05:38 UTC

Huawei’s Mate 90 uses a 3D chip design called LogicFolding to boost performance despite US curbs.

hardware

Sources

• T2Huawei’s Mate 90 bets on 3D chip design to get around US curbsAfrica: TechCabal / Techpoint Africa / TechCentral / WeeTracker / Ventureburn01 Oct, 05:38