Apple A20 Pro ditches PoP memory packaging for WMCM

T2Covered by 1 source · first reported by DigiTimes (headlines) at 30 Sept, 09:13 UTC

Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side to potentially improve packaging yield and thermal performance, according to a teardown analysis by TechInsights…