SK Hynix resumes DDR4, DDR5 packaging orders with Winpac

T2Covered by 1 source · first reported by DigiTimes (headlines) at 30 Sept, 07:33 UTC

SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023 as the memory maker increases the volume of flip-chip packaging handled by external partners.

hardware

Sources

• T2SK Hynix resumes DDR4, DDR5 packaging orders with WinpacDigiTimes (headlines)30 Sept, 07:33