Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant

T2Covered by 1 source · first reported by DigiTimes (headlines) at 30 Sept, 00:43 UTC

Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026, the first in the country capable of producing high-end flip chip ball grid array (FC-BGA) substrates. The approximately…

hardware

Sources

• T2Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plantDigiTimes (headlines)30 Sept, 00:43