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HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at

High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate the rollout of new memory capacity amid tightening supplies of both HBM and conventional DRAM.

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HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5 · TechNews