CyberPowerPC is offering five different pre-built gaming PCs with either an RTX 5070, 5080, or 5090 Founders Edition GPUs paired with either an Intel or AMD X3D CPU. They also come with 32GB of DDR5 RAM and 1TB of NVMe SSD, all for reasonable prices.
AIDC's Brave Eagle advanced jet trainer, a flagship "made-in-Taiwan" defense program, completed development and mass production on September 24, with AIDC chairman Chin-Pin Tsao personally leading the final delivery. The handover means all 66 production aircraft have now been delivered, marking a…
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Ensure you receive the latest and greatest Gadget Master posts, hot and fresh, straight into your inbox! The post Get the Gadget Master newsletter! appeared first on Electronics Weekly.
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Univity has announced the success of uniSpark, its first in-orbit technology demonstration mission and claims it as a world’s first, paving the way for new spectrum resources for satellite communications. […] The post Univity achieves first in-orbit 5G NTN TDD connection via mmWave link appeared…
CyboPal ONE is a 6-axis desktop robotic terminal designed to move a 27-inch 4K display using voice and gesture control, spatial sensing, and automatic display positioning based on the user’s position. It includes a camera, a binocular 3D sensor, and a motion sensor (IMU), and supports joint force…
Microsoft confirms September's KB5124012 and KB5124008 updates broke Always On VPN connections using automatic IKEv2/SSTP protocol fallback. Here's the workaround.
Honda Motor Co. is planning to invest JPY300 billion to JPY400 billion (about US$1.9 billion to US$2.5 billion) in a new hybrid electric vehicle plant in Ohio, with production targeted to begin as early as 2030. According to Nikkei, the project has entered final negotiations as Honda moves hybrids…
Qualcomm hat auf seinem Snapdragon Summit 2026 zwei neue Top-Prozessoren für Smartphones gezeigt. Der stärkere davon knackt die Marke von 5 GHz, die man früher nur von PCs kannte.weiterlesen auf t3n.de
Grab is expanding the scope of its Taiwan strategy beyond food delivery, launching an overseas expansion programme for merchants aimed at helping Taiwanese food and beverage (F&B) brands enter Southeast Asian markets.
Besides two new high-end Snapdragon chips for smartphones, Qualcomm unveiled a new chip, the Snapdragon Sound Elite Gen 2, for “hearables.” Yes, that is what the company is calling smart glasses and wireless earbuds that are capable of running an AI assistant. The Snapdragon Sound Elite Gen 2 has…
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Representing the game’s biggest content drop yet, Arc Raiders’ Frozen Trail update has been officially detailed ahead of its arrival on the 8th of October. The post Arc Raiders’ Frozen Trail update adds new map; grapple hook and much more first appeared on KitGuru.
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Indian semiconductor startups are seeking capital beyond seed rounds as they advance from prototypes and tape-out toward volume production. The post SEMICON India 2026: Startup Mitra Sheds Light on Early-Stage Silicon Startup Funding appeared first on EE Times.
ASRock Industrial, the industrial PC (IPC) arm of ASRock, posted a 95.4% year-over-year surge in first-half 2026 revenue after winning a major North American streaming services contract. The company is also expanding into robotics, entertainment, cybersecurity and edge computing as the IPC sector…
If you wanted to extract the firmware from a mystery device, you might pull the flash chip out of it and toss it into a reader. But if you only …read more
China's ChangXin Memory Technologies (CXMT) is gaining ground in the global DRAM market as Samsung Electronics and SK Hynix allocate more production capacity to high-bandwidth memory (HBM), tightening conventional memory supply and giving the Chinese supplier more room to expand without competing…
Meta has unveiled Muse Charm at Connect 2026, a keychain-sized device that runs its Muse AI agent with real-time voice and an animated avatar on a small screen. Users tap a fingerprint sensor to start a conversation, Reuters reports a 2-inch touchscreen and built-in 5G, and Meta aims to ship the…
LG Group is sharpening its focus on data centers, robotics, semiconductor materials, and enterprise AI as the South Korean conglomerate refines how it allocates capital across businesses moving toward commercialization at different speeds.
XFEON launched a physical-AI matrix led by Xinghe S1 (~105 TOPS INT8 / ~25W), the AGLobe embodied brain and Xinghui Token workstations, per September 22 coverage citing xfeon.com.
Moore Threads says MTT S5000 embodied RL training curves match mainstream GPUs at r=0.976, with RLinf CI integration and about 92 percent dual-arm real-robot assembly success.
The Xiaomi Pad 9 Pro is now official, and it's a relatively thin 12.5-inch tablet with a 144Hz display, 11,000mAh battery, and Snapdragon 8 Gen 5. In China, the starting price is about $566, which makes it pretty affordable for the performance-focused specs.
Semiconductor epitaxy maker Episil Precision said on September 22 that rising demand from AI data centers has created two main growth engines. Demand for silicon photonics optical communication modules is driving a surge in germanium silicon (GeSi) epitaxy demand, with the sector projected to grow…
China's AI industry is moving beyond policy-driven technological catch-up into a new phase centered on commercialization and ecosystem competition. Localization is no longer confined to replacing individual components; it is evolving towards full-stack, system-level optimization.
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Transporting the native packetized traffic of the NoC directly across die boundaries using a stable, invariant interface. The post A Network-on-Chip (NoC) For Multi-Die Devices appeared first on Semiconductor Engineering.
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Design data management, traceability, and revision control are critical for multi-chiplet heterogeneous integration. The post Managing 3D-IC Design And IP appeared first on Semiconductor Engineering.
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Specialization and orchestration are becoming more important as the role of AI agents in chip design widens, but coordination, control, and trust remain challenging The post When AI Agents Cross Chip Design Silos appeared first on Semiconductor Engineering.
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AI may accelerate semiconductor design, but users still need formal proof, semantic continuity, and auditable workflows to trust automation. The post EDA’s Future Is Evidence-Driven Automation appeared first on Semiconductor Engineering.
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Extracting advanced compact models and overcoming their shortcomings using a hybrid ANN approach at cryogenic temperatures. The post AI-Driven Device Modeling For Next Generation Quantum Applications appeared first on Semiconductor Engineering.